Germanium wafers for strained quantum wells with low disorder

Kavli Affiliate: Menno Veldhorst

| First 5 Authors: Lucas E. A. Stehouwer, Alberto Tosato, Davide Degli Esposti, Davide Costa, Menno Veldhorst

| Summary:

We grow strained Ge/SiGe heterostructures by reduced-pressure chemical vapor
deposition on 100 mm Ge wafers. The use of Ge wafers as substrates for epitaxy
enables high-quality Ge-rich SiGe strain-relaxed buffers with a threading
dislocation density of (6$pm$1)$times$10$^5$ cm$^{-2}$, nearly an order of
magnitude improvement compared to control strain-relaxed buffers on Si wafers.
The associated reduction in short-range scattering allows for a drastic
improvement of the disorder properties of the two-dimensional hole gas,
measured in several Ge/SiGe heterostructure field-effect transistors. We
measure an average low percolation density of (1.22$pm$0.03)$times$10$^{10}$
cm$^{-2}$, and an average maximum mobility of (3.4$pm$0.1)$times$10$^{6}$
cm$^2$/Vs and quantum mobility of (8.4$pm$0.5)$times$10$^{4}$ cm$^2$/Vs when
the hole density in the quantum well is saturated to
(1.65$pm$0.02)$times$10$^{11}$ cm$^{-2}$. We anticipate immediate application
of these heterostructures for next-generation, higher-performance Ge
spin-qubits and their integration into larger quantum processors.

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