BLAST: A Wafer-scale Transfer Process for Heterogeneous Integration of Optics and Electronics

Kavli Affiliate: Alyosha Molnar | Summary:We present a general transfer method for the heterogeneous integration of different photonic and electronic materials systems and devices onto a single substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process works at wafer scale and offers precision alignment, high yield, varying topographies, and suitability for subsequent […]


Continue.. BLAST: A Wafer-scale Transfer Process for Heterogeneous Integration of Optics and Electronics

BLAST: A Wafer-scale Transfer Process for Heterogeneous Integration of Optics and Electronics

Kavli Affiliate: Paul L. McEuen | First 5 Authors: Yanxin Ji, Alejandro J. Cortese, Conrad L. Smart, Alyosha C. Molnar, Paul L. McEuen | Summary: We present a general transfer method for the heterogeneous integration of different photonic and electronic materials systems and devices onto a single substrate. Called BLAST, for Bond, Lift, Align, and […]


Continue.. BLAST: A Wafer-scale Transfer Process for Heterogeneous Integration of Optics and Electronics